On October 19, 2023, the 29th Annual meeting and 30th anniversary of the Electronic Tin Solder Materials Branch of China Electronic Materials Industry Association was held in Zhuhai, Guangdong Province. With the theme of "Forging ahead for 30 years, keeping innovation and winning the Future", the annual meeting aims to sum up experience, commend advanced, study and judge the situation, boost confidence, and promote the high-quality development of industry enterprises.

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As the vice chairman unit and co-organizer of the electronic tin Solder Material Branch, Zhongshi Metal Company was invited to participate in this event, and won the "Outstanding contribution enterprise", "Scientific and Technological Innovation Award", "Social Contribution Award" and other awards.

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During the conference, experts and entrepreneurs in the industry were invited to exchange reports on a number of topics, such as the analysis and trend outlook of the global tin market, the related policies and future trends of tin mines in Myanmar, the development path of integrated circuits in the post-Moore era, and the application of welding materials in semiconductors.

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